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GEM microfinishing and superfinishing polishers. We manufacture microfinishing and superfinishing polishers, to meet the needs of all our customers. We make our standard polishers, and also special retro-fit, or a turn-key design. We will take your part and build a machine around it to fit your needs. GEM was the first microfinishing machine that was built in the early 1980's.
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Disco-DFD6240 Dicing Saw Among the world's smallest fully automatic dicing saws Φ200 mm Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the footprint is on par with that of DISCO's semi-automatic unit (DAD3350), even though it is equipped with all the functions of a fully automatic unit (size reduced by about 20% from the …
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Products/Services for Disco Back Grinding Machines. Grinders and Grinding Machines - (986 companies) Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish. Devices can be pneumatically driven or powered by a combustion engine or electric motor.
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The Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 368.31 million in 2020, and it is expected to reach 468.60 million by 2026, registering a CAGR of 4.1%. The growing need for miniaturization in the electronics is expected to drive some advancements in the semiconductor wafer polishing and grinding equipment market over …
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Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. ... Dicing and Grinding Service; Support. Support. Introduction to DISCO customer support, including support systems, product improvement information, and troubleshooting ...
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Details Dicing and Grinding Service It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost. Details Recommendation
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Semiconductor Wafer Polishing And Grinding Equipment Market: Key Drivers and Segmentation. Market Insights to Drive Recovery from COVID-19. The Global Semiconductor Wafer Polishing And Grinding Equipment Market is projected to grow by $ 289.72 mn, accelerating at a CAGR of about 3% till 2024. This research report delineates the growth …
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Laser Dicing. This method focuses laser energy onto a minute area for a very short time, thereby subliming and evaporating the solid. "Stealth Dicing™ process" forms a modified layer in the workpiece by focusing a laser inside the workpiece, and then a tape expander is used to separate the die. The range of applications for high-intensity ...
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Grinding; Lapping (1 or 2 steps) Polish and Chemical-Mechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps.
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DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge ...
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Grinding of Hollow Wafers. Recently, DISCO has received more requests to process hollow wafers for CMOS (complementary metal oxide semiconductor) image sensors and MEMS (micro electro mechanical systems). In order to meet such needs, DISCO is engaged in development of hollow wafer grinding. Here, our progress will be explained.
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Grinding Machines - Disc Grinders for sale listings - We have 38 listings for Disc Grinders listed below. Find items by using the following search options. You can also click on the column heading to sort through the listings. For more information on an item, contact the seller directly.
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Disco-DGP8761 Grinders High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher throughput The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief …
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UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain a gettering effect, which is often removed when a stress relief process is used. It is a chemical-free normal grinding process resulting in a low ...
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4 Inch Tile Blade,Stylish Y&I Porcelain Blade Super Thin Ceramic Diamond Saw Blades for Grinder Dry or Wet Tile Cutter Disc With Adapter 7/8",20mm,5/8 Inch Abor (4 inch) 4.5 out of 5 stars. 315. $9.74. $9. . 74. 10% coupon applied at checkout. Save 10% with coupon.
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Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI's grinding procedures produce unsurpassed precision and repeatability. Capabilities. Individual chip grinding. Wafer rounds up to 12" or 300MM.
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The Step Cut is performed by Disco's dual spindle dicing saws. Each spindle is equipped with a different dicing blade. This process is a solution to many problems currently faced (e.g. backside chipping) and can be integral in achieving an acceptable process for many different applications and wafer singulation.
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Accretech is best known for Probers and Measurement Instruments and tools, but they also have been manufacturing Dicing Saws since the 1970s. DAStech, a spinoff of Disco, is known as the leader in Slicing Saws and technology. We also offer a full line of dicing blades, back grind wheels, UV and Non-UV tape for both dicing and back grinding.
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About products and suppliers: coffee grind disc and their uses for a plethora of purposes whether commercial or heavy industrial are truly inevitable. At Alibaba, you can take care of your metalworking business by selecting the right sets of coffee grind disc ready to do it for you.coffee grind disc put up on the site are deft in metalworking activities and can significantly make jobs ...
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Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface's circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.
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Training Services | DISCO Corporation. We provide training for the authorized end-users of DISCO equipment. Training Center Features. Using 90% of training time in hands-on practice, trainees can learn actual operation and/or maintenance of the equipment. Our experienced trainers give the best training course to meet the needs of each customer.
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Disco spindle models we can repair are: Even if your Disco spindle is not listed above, we can repair it. Click haviland@precisionspindleinc or Contact Us in the footer below, or the header above, for an Air Bearing Repair Estimate or more information. Or call 519-671-3911.
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Dicing and Grinding Service. This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA (San Jose). It is also possible to provide these services with machines that ...
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A series of grinding steps follows whereby each new step makes use of even finer grinding medium, to proceed step-by-step towards the grade of polished surface desired. The sample has to be rotated through 90° after each grinding step, in order to cancel out the grooves left over from contact with the previous grinding medium.
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Grinding Rings Radius Rings . Fire Rings . The Starter Pack . Shop Now . Learn More . Accessories Accessories . Steel . Apparel . Parts . Service Plans . Gift Cards . Discover The Sharpener The Rings Find a Sparx Sharpening Payback Calculator Financing Our Company Careers Sparx News ...
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Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO's precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality. Consumables like tapes, dicing blades and grinding wheels complete our full service.
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Training Services. DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. ... DFP8140's design allows it to be integrated or retrofitted with DISCO grinders. Safer wafer transferring can be achieved when installed inline with ...
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